• DocumentCode
    2352002
  • Title

    A methodology for converting polygon based standard cell from bulk CMOS to SOI

  • Author

    Wu, Kevin Y. ; Chan, Philip C.H.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
  • fYear
    1994
  • fDate
    3-6 Oct 1994
  • Firstpage
    101
  • Lastpage
    102
  • Abstract
    The SOI (Silicon On Insulator) CMOS has many potential advantages over the traditional bulk CMOS circuit as it is free of latch-up and has improved performance and a higher packing density. The thin-film fully depleted SOI is the most attractive among other types SOI technologies not only due to its improved property such as subthreshold slope and reduced parasitic, but also due to its simple fabrication process comparing to bulk CMOS. It is becoming a viable technology for ULSI due to recent advances in high-quality thin-film SOI wafer technology. It has same layers as bulk CMOS except the well, the substrate contact and the well contact. In this paper we present a methodology to convert a polygon-based full-custom bulk CMOS to SOI/CMOS. The objective is to convert existing bulk CMOS layout to SOI automatically. The methodology is implemented using the Virtuoso Layout System from Cadence Design System. We shall illustrate the methodology using the Orbit Scalable CMOSN standard cell library
  • Keywords
    CMOS logic circuits; MOSFET; ULSI; cellular arrays; circuit layout CAD; logic CAD; silicon-on-insulator; CMOS circuit; Cadence Design System; SOI; ULSI; Virtuoso layout system; fabrication process; orbit scalable CMOSN standard cell library; packing density; polygon based standard cell; subthreshold slope; thin-film fully depleted MOSFET; wafer technology; CMOS process; CMOS technology; Fabrication; Layout; Libraries; Silicon on insulator technology; Substrates; Thin film circuits; Transistors; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1994 Proceedings., 1994 IEEE International
  • Conference_Location
    Nantucket, MA
  • Print_ISBN
    0-7803-2406-4
  • Type

    conf

  • DOI
    10.1109/SOI.1994.514266
  • Filename
    514266