DocumentCode :
2352003
Title :
HiSIM: hierarchical interconnect-centric circuit simulator
Author :
Chen, Tsung-Hao ; Tsai, Jeng-Liang ; Chen, Charlie C P ; Karnik, Tanay
Author_Institution :
Synopsis, Inc., Mountain View, CA, USA
fYear :
2004
fDate :
7-11 Nov. 2004
Firstpage :
489
Lastpage :
496
Abstract :
To ensure the power and signal integrity of modern VLSI circuits, it is crucial to analyze huge amount of nonlinear devices together with enormous interconnect and even substrate parasitics to achieve the required accuracy. Neither traditional circuit simulation engines such as SPICE nor switch-level timing analysis algorithms are equipped to handle such a tremendous challenge in both efficiency and accuracy. We establish a solid framework that simultaneously takes advantage of a hierarchical nonlinear circuit simulation algorithm and an advanced large-scale linear circuit simulation method using a new predictor-corrector algorithm. Under solid convergence and stability guarantees, our simulator, HiSIM, a hierarchical interconnect-centric circuit simulator, is capable of handling the post-layout RLKC power and signal integrity analysis task efficiently and accurately. Experimental results demonstrate over 180X speed up over the conventional flat simulation method with SPICE-level accuracy.
Keywords :
SPICE; VLSI; circuit simulation; integrated circuit interconnections; predictor-corrector methods; HiSIM; SPICE-level accuracy; VLSI circuits; advanced large-scale linear circuit simulation; hierarchical interconnect-centric circuit simulator; hierarchical nonlinear circuit simulation algorithm; nonlinear devices; power integrity; predictor-corrector algorithm; signal integrity; solid convergence; Analytical models; Circuit simulation; Engines; Integrated circuit interconnections; Predictive models; SPICE; Signal analysis; Solid modeling; Switching circuits; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
ISSN :
1092-3152
Print_ISBN :
0-7803-8702-3
Type :
conf
DOI :
10.1109/ICCAD.2004.1382627
Filename :
1382627
Link To Document :
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