• DocumentCode
    2352027
  • Title

    Bipolar transistors under positive and negative gate bias stress

  • Author

    Maiga, C.O. ; Tala-Ighil, B. ; Toutah, H. ; Boudart, B.

  • Author_Institution
    Ecole d´Ingenieurs de Cherbourg, Laboratoire Univ. des Sci. Appliquees de Cherbourg, France
  • Volume
    2
  • fYear
    2005
  • fDate
    20-23 June 2005
  • Firstpage
    435
  • Abstract
    The work presented in this paper is concerned with the effects of a positive and of a negative gate bias stress on punch-through insulated gate bipolar transistors (PT-IGBT´s). Two selections of PT IGBT´s all of the same nominal range were gate biased at their positive and negative maximum gate-to-emitter voltage with drain and emitter short-circuited at 140 /spl deg/C during 1200 hours. A particular interest was taken in the switching parameters. Experimental results on their evolution under the two types of stress are presented in a quantified way. Then, a qualitative analysis of the effects of the switching times shift, due to the IGBT´s ageing, on a PWM inverter operation is presented.
  • Keywords
    PWM invertors; insulated gate bipolar transistors; power bipolar transistors; switching convertors; 140 degC; IGBT ageing; PWM inverter; gate bias stress; gate-to-emitter voltage; punch-through insulated gate bipolar transistor; qualitative analysis; short-circuit emitter; switching parameters; Aging; Bipolar transistors; Insulated gate bipolar transistors; MOSFET circuits; Manufacturing; Pulse width modulation inverters; Static power converters; Stress; Substrates; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2005. ISIE 2005. Proceedings of the IEEE International Symposium on
  • Conference_Location
    Dubrovnik, Croatia
  • Print_ISBN
    0-7803-8738-4
  • Type

    conf

  • DOI
    10.1109/ISIE.2005.1528956
  • Filename
    1528956