DocumentCode
2352027
Title
Bipolar transistors under positive and negative gate bias stress
Author
Maiga, C.O. ; Tala-Ighil, B. ; Toutah, H. ; Boudart, B.
Author_Institution
Ecole d´Ingenieurs de Cherbourg, Laboratoire Univ. des Sci. Appliquees de Cherbourg, France
Volume
2
fYear
2005
fDate
20-23 June 2005
Firstpage
435
Abstract
The work presented in this paper is concerned with the effects of a positive and of a negative gate bias stress on punch-through insulated gate bipolar transistors (PT-IGBT´s). Two selections of PT IGBT´s all of the same nominal range were gate biased at their positive and negative maximum gate-to-emitter voltage with drain and emitter short-circuited at 140 /spl deg/C during 1200 hours. A particular interest was taken in the switching parameters. Experimental results on their evolution under the two types of stress are presented in a quantified way. Then, a qualitative analysis of the effects of the switching times shift, due to the IGBT´s ageing, on a PWM inverter operation is presented.
Keywords
PWM invertors; insulated gate bipolar transistors; power bipolar transistors; switching convertors; 140 degC; IGBT ageing; PWM inverter; gate bias stress; gate-to-emitter voltage; punch-through insulated gate bipolar transistor; qualitative analysis; short-circuit emitter; switching parameters; Aging; Bipolar transistors; Insulated gate bipolar transistors; MOSFET circuits; Manufacturing; Pulse width modulation inverters; Static power converters; Stress; Substrates; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2005. ISIE 2005. Proceedings of the IEEE International Symposium on
Conference_Location
Dubrovnik, Croatia
Print_ISBN
0-7803-8738-4
Type
conf
DOI
10.1109/ISIE.2005.1528956
Filename
1528956
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