• DocumentCode
    2352168
  • Title

    Deposition of Thin Metal Films by Means of Arc Discharges under Ultra-High Vacuum Conditions

  • Author

    Sadowski, Marek J. ; Strzyzewski, Pawel ; Nietubyc, Robert

  • Author_Institution
    Andrzej Soltan Inst. for Nucl. Studies (IPJ), Warsaw
  • fYear
    2007
  • fDate
    9-12 Sept. 2007
  • Firstpage
    1162
  • Lastpage
    1169
  • Abstract
    The paper reports on plasma technology of the production of thin metal layers by means of controlled arc discharges, initiated at ultra-high vacuum (UHV) conditions, i.e. at the background pressure < 10-8 Pa, and carried out at the operating pressure < 10-5 Pa. Different UHV arc facilities, which have been designed and operated at IPJ in Swierk, are described. The UHV arc facility equipped with a cylindrical cathode made of a pure niobium (Nb) is applied for the deposition of superconducting Nb layers upon inner surfaces of RF accelerator cavities. The UHV arc device equipped with a truncated-cone cathode made of pure lead (Pb) is used for the formation of photo-cathodes in RF electron guns. Filtering systems, which are used to reduce an amount of metal micro-droplets, are described. Characteristics of the deposited samples show that very pure and smooth metal films of the bulk-like crystalline structure can be produced by means of the described technique.
  • Keywords
    cathodes; electron guns; thin films; vacuum arcs; RF electron guns; UHV; arc discharges; controlled arc discharges; cylindrical cathode; thin metal films deposition; thin metal layers; truncated-cone cathode; ultra-high vacuum conditions; Arc discharges; Cathodes; Lead; Niobium; Paper technology; Plasmas; Production; Radio frequency; Superconducting filters; Vacuum arcs; Deposition; arc discharges; superconducting layers; thin films; vacuum;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    EUROCON, 2007. The International Conference on &#34;Computer as a Tool&#34;
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4244-0813-9
  • Electronic_ISBN
    978-1-4244-0813-9
  • Type

    conf

  • DOI
    10.1109/EURCON.2007.4400539
  • Filename
    4400539