Title :
Cooling Microstructure for Automotive Electronic Module
Author :
Widerski, Tomasz ; Raj, Ewa ; Lisik, Zbigniew
Author_Institution :
Tech. Univ. of Lodz, Lodz
Abstract :
The paper presents the general overview of the cooling microstructure concept dedicated for automotive electronic systems. It introduces the first design stage of the micro heat sink and presents preliminary simulations that consider adaptation of automotive coolants. The theoretical discussion is supported by simulations and calculations that were led with the aid of ANSYS software.
Keywords :
automotive electronics; coolants; cooling; heat sinks; ANSYS software; automotive coolants; automotive electronic module; cooling microstructure; micro heat sink; Automotive electronics; Automotive engineering; Consumer electronics; Control systems; Electronics cooling; Liquid cooling; Microstructure; Road safety; Temperature; Thermal management of electronics; IPM; automotive; cooling; microchannel;
Conference_Titel :
EUROCON, 2007. The International Conference on "Computer as a Tool"
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-0813-9
Electronic_ISBN :
978-1-4244-0813-9
DOI :
10.1109/EURCON.2007.4400540
