DocumentCode :
2352243
Title :
Moat edge oriented defects and buried oxide leakage in SIMOX integrated circuits
Author :
Brown, Grorge A. ; Jenkins, William C.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1994
fDate :
3-6 Oct 1994
Firstpage :
133
Lastpage :
134
Abstract :
We present evidence far the existence of a moat-edge-oriented defect distribution in SIMOX integrated circuits that provides an avenue for resolution of discrepancies between finished circuit quiescent substrate leakage (IBBQ) yields and buried oxide defect densities measured at pre-process materials qualification. The test structure used here is proposed as a process control vehicle for the silicon moat etching process and subsequent buried oxide etching, key components to the evolution of these defects
Keywords :
CMOS integrated circuits; SIMOX; buried layers; circuit optimisation; integrated circuit measurement; integrated circuit yield; sputter etching; BOXCAP; CMOS SIMOX; CMOS yield optimization; IBBQ yield; SIMOX integrated circuits; Si moat etching process; buried oxide capacitors; buried oxide defect densities; buried oxide etching; buried oxide leakage; moat edge oriented defects; preprocess materials qualification; process control vehicle; quiescent substrate leakage; test structure; Area measurement; Circuit testing; Density measurement; Etching; Instruments; Integrated circuit measurements; Process control; Qualifications; Random access memory; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1994 Proceedings., 1994 IEEE International
Conference_Location :
Nantucket, MA
Print_ISBN :
0-7803-2406-4
Type :
conf
DOI :
10.1109/SOI.1994.514282
Filename :
514282
Link To Document :
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