DocumentCode
2352295
Title
Multilevel expansion-based VLSI placement with blockages
Author
Bo Hu ; Marek-Sadowska, M.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear
2004
fDate
7-11 Nov. 2004
Firstpage
558
Lastpage
564
Abstract
The rapid growth of system-on-chip designs makes it a necessity for physical design tools to efficiently handle the coexistence of large intellectual property (IP) blocks and small standard cells in a single design. In this work, we present an efficient expansion-based placer to address standard-cell placement problem in the presence of blockages induced by pre-placed IP blocks. Expansion refers to the process during which cells are gradually distributed over a specified region. We implement expansion in a new placer by enhancing a quadratic placement technique based on fixed-point addition originally presented by B. Hu and M. Marek-Sadowska (2003), where fixed points were defined as dimensionless pseudo cells, and were deliberately introduced into the circuit to pull cells from one location to another. The new placer not only produces very competitive placement results over multiple sets of public-domain benchmarks with conventional rectangle-like chip boundary, but also efficiently handles the existence of blockages. Especially, we develop three expansion strategies and use them under different blockage settings.
Keywords
VLSI; fixed point arithmetic; integrated circuit layout; system-on-chip; expansion-based placer; fixed-point addition; intellectual property blocks; multilevel expansion-based VLSI placement; quadratic placement technique; standard-cell placement problem; system-on-chip design; Adaptive control; Chip scale packaging; Circuits; Design methodology; Intellectual property; Logic design; Programmable control; System-on-a-chip; Transistors; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-8702-3
Type
conf
DOI
10.1109/ICCAD.2004.1382640
Filename
1382640
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