• DocumentCode
    2352421
  • Title

    A metal and via maskset programmable VLSI design methodology using PLAs

  • Author

    Jayakumar, Nikhil ; Khatri, Sunil P.

  • Author_Institution
    Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    590
  • Lastpage
    594
  • Abstract
    In recent times there has been a substantial increase in the cost and complexity of fabricating a VLSI chip. The lithography masks themselves can cost between ε and ≥. It is conjectured that due to these increasing costs, the number of ASIC starts in the last few years has declined. We address this problem by using an array of dynamic PLAs which require only metal and via mask customization in order to implement a new design. This would allow several similar-sized designs to share the same base set of masks (right up to the metal layers) and only have different metal and via masks. We have implemented our methodology for both combinational and sequential designs, and demonstrate that our approach strikes a reasonable compromise between ASIC and field programmable design methodologies in terms of placed-and-routed area and delay. Our method has a 2.89× (3.58×) delay overhead and a 4.96× (3.44×) area overhead compared to standard cells for combinational (sequential) designs.
  • Keywords
    VLSI; combinational circuits; integrated circuit design; logic design; masks; programmable logic arrays; sequential circuits; ASIC; VLSI chip; combinational designs; field programmable design methodology; lithography masks; metal maskset; programmable VLSI design methodology; programmable logic array; sequential designs; via maskset; Application specific integrated circuits; Costs; Delay; Design methodology; Fabrication; Lithography; Logic arrays; Manufacturing; Programmable logic arrays; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-8702-3
  • Type

    conf

  • DOI
    10.1109/ICCAD.2004.1382645
  • Filename
    1382645