Novel system-in-package design and packaging solution for solid state lighting systems

With more implementation of LED in lighting and communication applications, increasing demand for function enrichment and miniaturization has emerged. Existed technologies are highly challenged. System-in-package (SiP) technology is very promising in terms of function integration and cost reduction. In this paper, a novel SiP platform for LED system with integrated driver and wireless control function has been developed for the first time and will be presented here. This platform consists of silicon submount design and fabrication, module packaging, system assembling, and testing and analyzing. As a demonstrator, this paper presents a bulb fabrication process and the testing results. The proposed SiP module includes driver and wireless control function besides light source and optics. The process can be achieved by regular packaging technology and existed standard infrastructures. According to the testing results, the assembled system shows satisfying performance.