Title :
A yield improvement methodology using pre- and post-silicon statistical clock scheduling
Author :
Tsai, Jeng-Liang ; Baik, DongHyun ; Chen, Charlie Chung-Ping ; Saluja, Kewal K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Abstract :
In deep sub-micron technologies, process variations can cause significant path delay and clock skew uncertainties thereby lead to timing failure and yield loss. In this paper, we propose a comprehensive clock scheduling methodology that improves timing and yield through both pre-silicon clock scheduling and post-silicon clock tuning. First, an optimal clock scheduling algorithm has been developed to allocate the slack for each path according to its timing uncertainty. To balance the skew that can be caused by process variations, programmable delay elements are inserted at the clock inputs of a small set of flip-flops on the timing critical paths. A delay-fault testing scheme combined with linear programming is used to identify and eliminate timing violations in the manufactured chips. Experimental results show that our methodology achieves substantial yield improvement over a traditional clock scheduling algorithm in many of the ISCAS89 benchmark circuits, and obtain an average yield improvement of 13.6%.
Keywords :
circuit optimisation; flip-flops; integrated circuit yield; linear programming; logic design; sequential circuits; ISCAS89 benchmark circuits; clock skew uncertainty; deep sub-micron technology; delay-fault testing scheme; flip-flops; linear programming; path delay; post-silicon clock tuning; post-silicon statistical clock scheduling; pre-silicon statistical clock scheduling; process variations; programmable delay elements; slack allocation; timing critical paths; timing failure; timing uncertainty; yield improvement methodology; yield loss; Circuit testing; Clocks; Delay; Flip-flops; Job shop scheduling; Linear programming; Manufacturing; Scheduling algorithm; Timing; Uncertainty;
Conference_Titel :
Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
Print_ISBN :
0-7803-8702-3
DOI :
10.1109/ICCAD.2004.1382649