Active die embedded small form factor RF packages for ultrabooks and smartphones

This paper reports on the design, fabrication and characterization of active die embedded ultra slim system-in-packages suitable for integrating RF and digital integrated circuits, and discrete components. Portable communication devices such as Ultrabooks, tablets and smart phones require very small form factor radio subsystems. To address this need, several proof of concept (POC) packages with embedded active die have been designed and characterized. A 50% form factor reduction compared to packages currently used in radio system half minicards is achieved by using this packaging approach. Test results show that the radio frequency (RF) performance of this small form factor (SFF) SiP is within the system specification.