Board level reliability for laminate CSP

Author

Yoshida, Aluto ; Kudo, Isao ; Hart, Curtis ; Partridge, Julian

Author_Institution

Toshiba Corp., Kawasaki, Japan

fYear

1998

fDate

19-21 Oct 1998

Firstpage

315

Lastpage

322

Abstract

An experiment was conducted to determine card assembly reliability of 0.8 mm laminate chip scale packages (CSPs) on FR4 card material. Accelerated temperature cycle tests (TCT) and card-bending tests were conducted to determine the optimum size and type of pad for card assemblies. Toshiba supplied the CSPs for this study. The CSPs were 177 I/O 13 mm×13 mm overmolded packages with laminate interposers. XeTel supplied the cards and card assembly. Toshiba performed the accelerated testing. Two nonsolder-mask defined (NSMD) pad designs and two solder-mask defined (SMD) pad designs were used for the test card. The temperature cycle range was from -55°C to +125° C. CSP reliability was determined in an independent study by Toshiba, the results of which are included for reference. CSP construction and reliability, card design and assembly processes, test results, and conclusions are presented

Keywords

assembling; bending; chip scale packaging; circuit reliability; encapsulation; laminates; life testing; masks; moulding; printed circuit design; printed circuit testing; soldering; thermal analysis; thermal stresses; -55 to 125 C; 0.8 mm; 13 mm; CSP assembly processes; CSP card design; CSP construction; CSP reliability; FR4 card material; accelerated temperature cycle tests; accelerated testing; board level reliability; card assemblies; card assembly; card assembly reliability; card-bending tests; laminate CSP; laminate chip scale packages; laminate interposers; nonsolder-mask defined pad designs; optimum pad size; optimum pad type; overmolded packages; solder-mask defined pad designs; temperature cycle range; Assembly; Chip scale packaging; Conducting materials; Laminates; Life estimation; Materials reliability; Performance evaluation; Process design; Temperature distribution; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731088

Filename

731088