Improving SPC in a wafer fabrication environment

Author

Aston, Dayna

Author_Institution

Medtronic Micro-Rel, Tempe, AZ, USA

fYear

1998

fDate

19-21 Oct 1998

Firstpage

346

Lastpage

351

Abstract

Statistical process control has been prevalent in American industries since the 1980s. However, following the textbook methodology for a wafer fab environment can lead to a system that causes much frustration. Proper SPC usage can be a very delicate issue. There are important issues of which to be aware, such as dealing with autocorrelated data, trying to control a nonstationary mean, and handling run-to-run variability versus within-run variability. This paper outlines one facility´s approach to re-evaluation of their SPC program in the wafer fab area and ways of approaching these issues

Keywords

correlation methods; integrated circuit technology; integrated circuit yield; statistical process control; SPC; SPC program; SPC usage; autocorrelated data; nonstationary mean control; run-to-run variability; statistical process control; textbook SPC methodology; wafer fab environment; wafer fabrication environment; within-run variability; Autocorrelation; Biographies; Electrical equipment industry; Fabrication; Industrial control; Industrial engineering; Monitoring; Process control; Production systems; Quality management; Reliability engineering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731092

Filename

731092