• DocumentCode
    2353007
  • Title

    Frugal linear network-based test decompression for drastic test cost reductions

  • Author

    Rao, Wenjing ; Orailoglu, Alex ; Su, George

  • Author_Institution
    Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA, USA
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    721
  • Lastpage
    725
  • Abstract
    In This work we investigate an effective approach to construct a linear decompression network in the multiple scan chain architecture. A minimal pin architecture, complemented by negligible hardware overhead, is constructed by mathematically analysing test data relationships, delivering in turn drastic test reductions. The proposed network drives a large number of internal scan chains with a short input vector, thus allowing significant reductions in both test time and test volume. The proposed method constructs an inverter-interconnect based network by exploring the pairwise linear dependencies of the internal scan chain vectors, resulting in a very low cost network that is nonetheless capable of outperforming much costlier compression schemes. We propose an iterative algorithm to construct the network from an initial set of test cubes. The experimental data shows significant reductions in test time and test volume with no loss of fault coverage.
  • Keywords
    automatic test pattern generation; integrated circuit testing; iterative methods; sequential circuits; fault coverage; hardware overhead; inverter-interconnect based network; iterative algorithm; linear decompression network; linear network-based test decompression; minimal pin architecture; multiple scan chain architecture; test data relationships; test time; test volume; Automatic testing; Circuit faults; Circuit testing; Compaction; Computer architecture; Costs; Hardware; Sequential circuits; System testing; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-8702-3
  • Type

    conf

  • DOI
    10.1109/ICCAD.2004.1382670
  • Filename
    1382670