DocumentCode
2353428
Title
Greater mobility through lower power
Author
Browning, David W. ; Distefano, Eric
Author_Institution
PC Client Group, Intel Corp., Santa Clara, CA, USA
fYear
2010
fDate
16-18 Dec. 2010
Firstpage
1
Lastpage
5
Abstract
Mobile Original Equipment Manufacturers (OEMs) place great emphasis on creating unique system designs to differentiate themselves in the mobile market. Intel Corporation´s introduction of low-power, high-performance Intel® processors based on original 45 nm Intel Core™ microarchitecture, originally referred to by the codename Penryn, brings a new level of opportunity for differentiation into the mainstream segment without sacrificing performance. The Mobile Penryn family of processors offers mainstream performance at 25 watts (W) Thermal Design Power (TDP), 10 W less than previous generation processors. In this paper we discuss the fundamentals of system cooling capabilities in any given form factor and look at how power relates to the thinner, cooler, and quieter systems.
Keywords
cooling; low-power electronics; microprocessor chips; mobile computing; portable computers; Intel Core microarchitecture; Intel corporation; Temperature; low-power high-performance Intel processors; mobile Penryn family; mobile market; mobile original equipment manufacturers; processors family; size 45 nm; system cooling capabilities; thermal design power;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Aware Computing (ICEAC), 2010 International Conference on
Conference_Location
Cairo
Print_ISBN
978-1-4244-8273-3
Type
conf
DOI
10.1109/ICEAC.2010.5702305
Filename
5702305
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