• DocumentCode
    2353428
  • Title

    Greater mobility through lower power

  • Author

    Browning, David W. ; Distefano, Eric

  • Author_Institution
    PC Client Group, Intel Corp., Santa Clara, CA, USA
  • fYear
    2010
  • fDate
    16-18 Dec. 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Mobile Original Equipment Manufacturers (OEMs) place great emphasis on creating unique system designs to differentiate themselves in the mobile market. Intel Corporation´s introduction of low-power, high-performance Intel® processors based on original 45 nm Intel Core™ microarchitecture, originally referred to by the codename Penryn, brings a new level of opportunity for differentiation into the mainstream segment without sacrificing performance. The Mobile Penryn family of processors offers mainstream performance at 25 watts (W) Thermal Design Power (TDP), 10 W less than previous generation processors. In this paper we discuss the fundamentals of system cooling capabilities in any given form factor and look at how power relates to the thinner, cooler, and quieter systems.
  • Keywords
    cooling; low-power electronics; microprocessor chips; mobile computing; portable computers; Intel Core microarchitecture; Intel corporation; Temperature; low-power high-performance Intel processors; mobile Penryn family; mobile market; mobile original equipment manufacturers; processors family; size 45 nm; system cooling capabilities; thermal design power;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Aware Computing (ICEAC), 2010 International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-4244-8273-3
  • Type

    conf

  • DOI
    10.1109/ICEAC.2010.5702305
  • Filename
    5702305