• DocumentCode
    235346
  • Title

    Novel sealing technology for organic EL display and lighting by means of modified surface activated bonding method

  • Author

    Matsumae, Takashi ; Fujino, Masahisa ; Suga, Takashi

  • Author_Institution
    Dept. of Precision Eng., Univ. of Tokyo., Tokyo, Japan
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1504
  • Lastpage
    1508
  • Abstract
    For a sealing of organic electro luminescence displays and lightings, a room temperature bonding of polymer films without organic adhesives is required. This paper describes a new bonding technique called modified surface activated bonding (mSAB) method using nano-adhesion layer that meets the requirement. Polymer films such as PEN, PET and PI can be bonded by this method. Especially PEN and PET films are so strongly bonded that the bond interface has tolerance for bending and loci of fracture after a peeling test are located in the polymer bulk. The organic electro luminescence lighting bonded by the proposed method clears environmental tests such as high temperature and high humidity tests.
  • Keywords
    adhesion; adhesive bonding; electroluminescent displays; fracture; lighting; polymer films; seals (stoppers); bond interface; fracture; lightings; modified surface activated bonding method; nanoadhesion layer; organic electroluminescence displays; polyethylene naphthalate; polyethylene terephthalate; polyimide; polymer films; sealing technology; Bonding; Polymer films; Polymers; Positron emission tomography; Surface cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897493
  • Filename
    6897493