DocumentCode
235346
Title
Novel sealing technology for organic EL display and lighting by means of modified surface activated bonding method
Author
Matsumae, Takashi ; Fujino, Masahisa ; Suga, Takashi
Author_Institution
Dept. of Precision Eng., Univ. of Tokyo., Tokyo, Japan
fYear
2014
fDate
27-30 May 2014
Firstpage
1504
Lastpage
1508
Abstract
For a sealing of organic electro luminescence displays and lightings, a room temperature bonding of polymer films without organic adhesives is required. This paper describes a new bonding technique called modified surface activated bonding (mSAB) method using nano-adhesion layer that meets the requirement. Polymer films such as PEN, PET and PI can be bonded by this method. Especially PEN and PET films are so strongly bonded that the bond interface has tolerance for bending and loci of fracture after a peeling test are located in the polymer bulk. The organic electro luminescence lighting bonded by the proposed method clears environmental tests such as high temperature and high humidity tests.
Keywords
adhesion; adhesive bonding; electroluminescent displays; fracture; lighting; polymer films; seals (stoppers); bond interface; fracture; lightings; modified surface activated bonding method; nanoadhesion layer; organic electroluminescence displays; polyethylene naphthalate; polyethylene terephthalate; polyimide; polymer films; sealing technology; Bonding; Polymer films; Polymers; Positron emission tomography; Surface cleaning;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897493
Filename
6897493
Link To Document