Motorola´s PowerPC 603 and PowerPC 604 RISC microprocessor: the C4/ceramic-ball-grid array interconnect technology

Author

Kromann, Gary B. ; Gerke, David ; Huang, Wayne

Author_Institution

Motorola Inc., Austin, TX, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

1

Lastpage

9

Abstract

The Motorola PowerPC 603 and PowerPC 604 microprocessors are available in the 21 mm controlled-collapsed-chip-connection/ceramic-ball-grid-array single-chip package (C4/CBGA). This paper will introduce the C4/CBGA interconnect technology and address the following: (1) the PCB land definition and board preparation requirements, (2) the ball-grid-array to board assembly methods, (3) the electrical design considerations, (4) the heat transfer mechanism and thermal control options, and (5) the CBGA-to-PCB testing and reliability

Keywords

assembling; cooling; heat sinks; integrated circuit packaging; microprocessor chips; printed circuit layout; reduced instruction set computing; 21 mm; C4/ceramic-ball-grid array interconnect technology; CBGA-to-PCB testing; Motorola; PCB land definition; PowerPC 603; PowerPC 604; RISC microprocessor; board assembly methods; board preparation requirements; controlled-collapsed-chip-connection; electrical design considerations; heat transfer mechanism; single-chip package; thermal control options; Assembly; Copper; Heat transfer; LAN interconnection; Microprocessors; Reduced instruction set computing; Resistance heating; Semiconductor device packaging; Temperature control; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514354

Filename

514354