Title :
Motorola´s PowerPC 603 and PowerPC 604 RISC microprocessor: the C4/ceramic-ball-grid array interconnect technology
Author :
Kromann, Gary B. ; Gerke, David ; Huang, Wayne
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
The Motorola PowerPC 603 and PowerPC 604 microprocessors are available in the 21 mm controlled-collapsed-chip-connection/ceramic-ball-grid-array single-chip package (C4/CBGA). This paper will introduce the C4/CBGA interconnect technology and address the following: (1) the PCB land definition and board preparation requirements, (2) the ball-grid-array to board assembly methods, (3) the electrical design considerations, (4) the heat transfer mechanism and thermal control options, and (5) the CBGA-to-PCB testing and reliability
Keywords :
assembling; cooling; heat sinks; integrated circuit packaging; microprocessor chips; printed circuit layout; reduced instruction set computing; 21 mm; C4/ceramic-ball-grid array interconnect technology; CBGA-to-PCB testing; Motorola; PCB land definition; PowerPC 603; PowerPC 604; RISC microprocessor; board assembly methods; board preparation requirements; controlled-collapsed-chip-connection; electrical design considerations; heat transfer mechanism; single-chip package; thermal control options; Assembly; Copper; Heat transfer; LAN interconnection; Microprocessors; Reduced instruction set computing; Resistance heating; Semiconductor device packaging; Temperature control; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514354
