DocumentCode :
2353690
Title :
Formimg local semi-insulating regions on silicon wafers by proton bombardment
Author :
Liao, C. ; Huang, T.-H. ; Lee, C.-Y. ; Tang, D.-L. ; Lan, S.-M. ; Yang, T.-N. ; Lin, L.-F.
Author_Institution :
Electron. Res. Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
1998
fDate :
22-24 June 1998
Firstpage :
80
Lastpage :
81
Abstract :
High-resistivity silicon substrates are desirable for mixed-mode and RF integrated circuits, as it damps the substrate noise in the former and provides high Q-factor inductors and low-loss resonators in the latter. Unlike GaAs, semi-insulating silicon substrates are very hard to obtain. This paper demonstrates a low-cost method that creates local semi-insulating regions in typical silicon wafers with substrate resistivity of around 10 /spl Omega/-cm. We show that local semi-insulating substrates can be formed by MeV proton bombardment of silicon wafers. The M/spl Omega/-cm resistivity substrate is ideal for RF applications and mixed mode IC applications.
Keywords :
electrical resistivity; elemental semiconductors; integrated circuit technology; microwave integrated circuits; mixed analogue-digital integrated circuits; proton effects; silicon; surface treatment; 10 ohmcm; Q-factor; RF integrated circuits; Si; high-resistivity silicon substrates; inductors; local semi-insulating region formation; local semi-insulating regions; local semi-insulating substrates; low-loss resonators; mixed mode IC applications; mixed-mode integrated circuits; proton bombardment; resistivity; semi-insulating silicon substrates; silicon wafers; substrate noise; substrate resistivity; Application specific integrated circuits; Conductivity; Gallium arsenide; Inductors; Integrated circuit noise; Protons; Q factor; Radio frequency; Radiofrequency integrated circuits; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference Digest, 1998. 56th Annual
Conference_Location :
Charlottesville, VA, USA
Print_ISBN :
0-7803-4995-4
Type :
conf
DOI :
10.1109/DRC.1998.731130
Filename :
731130
Link To Document :
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