Title :
Cross-layer optimization schemes based on HARQ for Device-to-Device communication
Author :
Miao, M.M. ; Sun, Jian ; Shao, S.X.
Author_Institution :
Jiangsu Provincial Key Lab. of Wireless Commun., Nanjing Univ. of Posts & Telecommun., Nanjing, China
Abstract :
The introduction of device-to-device(D2D) technology into LTE system could bring such mutual interferences between cellular users and D2D users that the instantaneous channel quality become worse in D2D communication. In this paper, with the purpose to make up for the link loss that caused by serious interferences and to optimize the performance of Device-to-Device communication, we consider a cross-layer framework which combines hybrid automatic repeat request(HARQ) protocol at the data link layer with the adaptive modulation and coding(AMC) technique at physical layer under the prescribed packet rate and average delay. At the same time, we compare the three types HARQ schemes in terms of throughput. Numerical simulation results illustrate that the application of type III HARQ could achieve the highest throughput and the performance of overall system is better than conventional scheme.
Keywords :
Long Term Evolution; adaptive codes; adaptive modulation; automatic repeat request; cellular radio; modulation coding; optimisation; radio links; radiofrequency interference; wireless channels; AMC technique; D2D communication user; LTE system; adaptive modulation and coding technique; average delay; cellular user; cross-layer optimization scheme; data link layer; device-to-device technology; hybrid automatic repeat request protocol; instantaneous channel quality; link loss; mutual interference; packet rate; physical layer; type III HARQ protocol; Base stations; Interference; Physical layer; Receivers; Signal to noise ratio; Silicon; Throughput; AMC; Cross-layer; Device-to-Device communication; HARQ;
Conference_Titel :
Computing, Communications and IT Applications Conference (ComComAp), 2014 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-4813-0
DOI :
10.1109/ComComAp.2014.7017173