DocumentCode
235375
Title
Parameter optimization in assembly manufacturing process for a power module
Author
Yumin Liu ; Yong Liu
Author_Institution
Fairchild Semicond. Corp., South Portland, ME, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1601
Lastpage
1605
Abstract
In this paper, the trimming process in manufacture of a power module is investigated by using the commercial FE code Ansys/LS-dyna®. The setup of the trimming process consists of an automated system of cutting die, stripper, punch, and etc. The design and interworking of these tools are quite critical. On one hand, when the gap between the punch and stripper/cutting die is too big, the dambar may not be fully cut as expected. On the other hand, when the gap is too small, the punch might be broken after some cycles due to flash contamination on the tools. If the stripper clamp is too close to the package body, high stress might be generated in the package edge or even in the silicon chips to induce package crack or die crack. The DoE legs with regard to the gap between the punch & stripper and the distance between the stripper clamp & the package body are conducted by the FE dynamic simulations. The simulation results provide good guidance for the assembly process parameter setting.
Keywords
assembling; finite element analysis; integrated circuit packaging; modules; DoE legs; FE dynamic simulations; assembly manufacturing process; automated system; commercial FE code Ansys-LS-dyna; cutting die; die crack; flash contamination; high stress; package body; package crack; package edge; parameter optimization; power module; punch; silicon chips; stripper clamp; trimming process; Assembly; Clamps; Compounds; History; Iron; Multichip modules; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897508
Filename
6897508
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