• DocumentCode
    235382
  • Title

    Design and fabrication of low-pressure piezoresistive MEMS sensor for fuel cell electric vehicles

  • Author

    Minkyu Lee ; Kiyoung Nam ; Sengyong Lee ; Hakgu Kim ; Chimyung Kim ; Yongsun Park ; Byungki Ahn ; Taewan Kim ; Hochul Seo

  • Author_Institution
    Hyundai Motor Co., Yongin, South Korea
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1616
  • Lastpage
    1621
  • Abstract
    This research focuses on the design and fabrication of a MEMS-based pressure sensor to measure the internal pressure of a thermal management system for fuel cell electric vehicles. The principle of measurement of the pressure is converting the piezoresistor value on a diaphragm deformed by a pressure difference into an output voltage. The diaphragm should operate normally for pressure sensing even harsh environments such as those in automobiles. However, the pressure sensor outputs abnormal values with an offset voltage due to physical and chemical factors during driving. One of the reasons is the polymer reaction originating from the coolant of the thermal management system between the polymer and sensor diaphragm. In this paper, the reason for abnormal operation is analyzed by measurement with a microscope, computational fluid dynamics, finite element method, and reproducible tests. A solution is suggested and a revised pressure sensor is proposed.
  • Keywords
    computational fluid dynamics; coolants; diaphragms; finite element analysis; fuel cell vehicles; microfabrication; microscopes; microsensors; piezoresistive devices; pressure measurement; pressure sensors; thermal management (packaging); computational fluid dynamic; finite element method; fuel cell electric vehicle; low-pressure piezoresistive MEMS sensor fabrication; microscope; piezoresistor value conversion; polymer reaction; pressure measurement; pressure sensor diaphargm deforming; reproducible test; thermal management system coolant; Coolants; Finite element analysis; Force; Measurement by laser beam; Polymers; Stress; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897511
  • Filename
    6897511