Gold wire bonding onto flexible polymeric substrates

Author

Hall, Elizabeth ; Lyons, Alan M. ; Weld, John D.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

86

Lastpage

90

Abstract

Copper clad polymeric materials were examined as potential substrates for wire bonded chip-on-flex circuits. New thermoplastic flex and a PTFE/woven glass substrate were evaluated along with polyimides using high temperature copper laminate adhesives and adhesiveless constructions. Initial wire bond pull tests indicated all the materials were suitable for high temperature gold wire bonding. Similarly, conventional glob top encapsulants were found to adhere to each of the thirteen substrates tested; experimental UV curable glob top materials were found to adhere well to polyester and PTFE substrates, but not to polyimides or polyether imides

Keywords

gold; lead bonding; polymers; substrates; Au; PTFE/woven glass substrate; UV curing; adherence; chip-on-flex circuit; copper laminate adhesives; flexible polymeric substrates; glob top encapsulants; high temperature gold wire bonding; polyesters; polyether imides; polyimides; pull tests; thermoplastic flex; Bonding; Circuits; Copper; Glass; Gold; Materials testing; Polyimides; Polymers; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514366

Filename

514366