Fine pitch COG interconnections using anisotropically conductive adhesives

Author

Lee, Chang Hoon ; Loh, Karl I.

Author_Institution

Samsung Display Devices Ltd., Seoul, South Korea

fYear

1995

fDate

21-24 May 1995

Firstpage

121

Lastpage

125

Abstract

Chip-on-glass (COG) assembly technology using anisotropically conductive adhesives (ACA´s) is being developed to achieve fine pitch interconnections between driver IC´s and flat panel displays. The reliability of a UV curable anisotropically conductive adhesive (ACA) has been demonstrated and a prototype display has been built. Interconnection pitches were 130 micron. Furthermore, a method is proposed to achieve fine pitch COG interconnections of less than 50 micron pitch

Keywords

adhesion; fine-pitch technology; flat panel displays; integrated circuit interconnections; 130 micron; UV curing; anisotropically conductive adhesives; chip-on-glass assembly technology; driver ICs; fine pitch COG interconnections; flat panel displays; reliability; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Flat panel displays; Glass; Integrated circuit modeling; Integrated circuit testing; Liquid crystal displays; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514371

Filename

514371

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2353921