Title :
Fine pitch COG interconnections using anisotropically conductive adhesives
Author :
Lee, Chang Hoon ; Loh, Karl I.
Author_Institution :
Samsung Display Devices Ltd., Seoul, South Korea
Abstract :
Chip-on-glass (COG) assembly technology using anisotropically conductive adhesives (ACA´s) is being developed to achieve fine pitch interconnections between driver IC´s and flat panel displays. The reliability of a UV curable anisotropically conductive adhesive (ACA) has been demonstrated and a prototype display has been built. Interconnection pitches were 130 micron. Furthermore, a method is proposed to achieve fine pitch COG interconnections of less than 50 micron pitch
Keywords :
adhesion; fine-pitch technology; flat panel displays; integrated circuit interconnections; 130 micron; UV curing; anisotropically conductive adhesives; chip-on-glass assembly technology; driver ICs; fine pitch COG interconnections; flat panel displays; reliability; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Flat panel displays; Glass; Integrated circuit modeling; Integrated circuit testing; Liquid crystal displays; Prototypes;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514371
