DocumentCode
2353930
Title
A novel elastomeric connector for packaging interconnections, testing and burn-in applications
Author
Shih, D.-Y. ; Beaman, B. ; Lauro, P. ; Fogel, K. ; Norcott, M. ; Walker, G.F. ; Hedrick, J. ; Shi, L. ; Doany, F. ; Shaw, J.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1995
fDate
21-24 May 1995
Firstpage
126
Lastpage
133
Abstract
Elasticon connectors have been developed for a wide variety of interconnection and test applications which include module-to-board, board-to-board interconnections; high density module, board and LCD testings; as well as chip/wafer testing and burn-in to produce Known-Good-Die. Depending on the applications, the Elasticon connectors can be fabricated into two basic types, the single-sided (integrated to a substrate) and the double-sided (interposer) structure. The single-sided structure, the Integrated Probe, is designed and fabricated for test and burn-in applications. The density, compliance, thickness, pattern and size of both the one- and two-sided structures can be easily tailored to meet the requirements of each specific application. The fabrication processes involve wire bonding, laser and polymer casting and curing. The electrical, mechanical and thermal properties of the connector have been fully characterized. To achieve high compliance with low contact force, a proprietary elastomeric material has been formulated to achieve not only high compliance but high thermal stability. The conductive element uses highly conductive, corrosion free, and oxidation resistant noble metals and their alloys. The reliability and durability of the elastomeric connector have been evaluated with mechanical cycling, thermal cycling, stress relaxation, outgassing, and temperature and humidity rest. The thermal stability of the connector, including both the polymer and the conductive element, has been measured to exceed the burn-in temperatures, which range from 125 to 180°C
Keywords
elastomers; electric connectors; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; plastic packaging; 125 to 180 C; Elasticon; Integrated Probe; Known-Good-Die; LCD testing; board testing; board-to-board interconnections; burn-in; chip/wafer testing; compliance; contact force; double-sided structure; durability; elastomeric connector; fabrication; high density module testing; interposer type probe; module-to-board interconnections; packaging; reliability; single-sided structure; thermal stability; Connectors; Optical device fabrication; Packaging; Polymers; Probes; Testing; Thermal force; Thermal stability; Thermal stresses; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.514372
Filename
514372
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