Title :
SPICE-models for high pincount board connectors
Author :
Katzier, H. ; Reischl, R. ; Pagnin, Peter
Author_Institution :
Public Commun. Networks, Siemens AG, Munich, Germany
Abstract :
We present results obtained from a reliable SPICE model for SIPAC connectors. By means of typical measurement and simulation results the reliability of the simulation model is demonstrated. All important electric characteristics of the connectors can be simulated by the SPICE-model, e.g. different time delays and characteristic impedances, transmission and reflection characteristics and near-end and far-end crosstalk. There are no restrictions in the simulation concerning pin assignments. The comparison between simulation and measurement is very good up to a limit of f=3 GHz and a risetime of tr>35 psec
Keywords :
SPICE; crosstalk; electric connectors; 3 GHz; 35 ps; SIPAC connectors; SPICE; characteristic impedances; crosstalk; electric characteristics; high pincount board connectors; reflection; simulation model; time delays; transmission; Circuit simulation; Connectors; Coupling circuits; Crosstalk; Delay effects; Equivalent circuits; Impedance; Integrated circuit modeling; Pins; Reflection;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514376
