Title :
Transparent dynamic binding with fault-tolerant cache coherence protocol for chip multiprocessors
Author :
Shan, Shuchang ; Hu, Yu ; Li, Xiaowei
Author_Institution :
Key Lab. of Comput. Syst. & Archit., CAS, Beijing, China
Abstract :
Aggressive technology scaling causes chip multiprocessors increasingly error-prone. Core-level fault-tolerant approaches bind two cores to implement redundant execution and error detection. However, along with more cores integrated into one chip, existing static and dynamic binding schemes suffer from the scalability problem when considering the violation effects caused by external write operations. In this paper, we present a transparent dynamic binding (TDB) mechanism to address the issue. Learning from static binding schemes, we involve the private caches to hold identical data blocks, thus we reduce the global masters-lave consistency maintenance to the scale of the private caches. With our fault-tolerant cache coherence protocol, TDB satisfies the objective of private cache consistency, therefore provides excellent scalability and flexibility. Experimental results show that, for a set of parallel workloads, the overall performance of our TDB scheme is very close to that of baseline fault-tolerant systems, outperforming dynamic core coupling by 9.2%, 10.4%, 18% and 37.1% when considering 4, 8, 16 and 32 cores respectively.
Keywords :
fault tolerant computing; microprocessor chips; protocols; TDB; chip multiprocessors; core level fault tolerant approaches; dynamic binding schemes; dynamic core coupling; error detection; fault tolerant cache coherence protocol; fault-tolerant systems; redundant execution; scalability problem; static binding schemes; transparent dynamic binding; Coherence; Fault tolerance; Fault tolerant systems; Master-slave; Pipelines; System-on-a-chip; Chip multiprocessor; cache coherence protocol; fault tolerance; master-slave memory consistency; transparent dynamic binding (TDB);
Conference_Titel :
Dependable Systems & Networks (DSN), 2011 IEEE/IFIP 41st International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9232-9
Electronic_ISBN :
1530-0889
DOI :
10.1109/DSN.2011.5958227