Title :
Novel integration of substrate input/output vertical cavity lasers and resonant photodetectors
Author :
Louderback, D.A. ; Sjolund, O. ; Hegblom, E.R. ; Ko, J. ; Coldren, L.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
We present the first monolithic integration, without regrowth, of high-performance substrate input/output vertical-cavity lasers (VCLs) and resonant photodetectors that are compatible with flip-chip bonding and integrated microlenses. Integrated arrays of these devices are critical components for very dense bi-directional free-space optical interconnects. VCLs and resonant detectors fabricated side-by-side on the same chip have the same wavelength of operation to within <0.5 nm. The VCLs exhibit very low threshold currents, as low as 174 μA, and good differential efficiencies as high as 61%. The adjacent detectors are efficient, as demonstrated by responsivities of ∼0.4 A/W, with relatively broad optical bandwidths of ∼6 nm.
Keywords :
flip-chip devices; integrated optoelectronics; microlenses; optical interconnections; photodetectors; semiconductor device packaging; semiconductor lasers; 174 muA; 61 percent; bi-directional free-space optical interconnects; detector responsivity; differential efficiency; flip-chip bonding; integrated device arrays; integrated microlenses; monolithic integration; operating wavelength; optical bandwidth; substrate input/output resonant photodetectors; substrate input/output vertical cavity lasers; threshold current; vertical cavity laser/resonant photodetector integration; Bidirectional control; Bonding; Lenses; Microoptics; Monolithic integrated circuits; Optical arrays; Optical interconnections; Photodetectors; Resonance; Vertical cavity surface emitting lasers;
Conference_Titel :
Device Research Conference Digest, 1998. 56th Annual
Conference_Location :
Charlottesville, VA, USA
Print_ISBN :
0-7803-4995-4
DOI :
10.1109/DRC.1998.731156