• DocumentCode
    2354166
  • Title

    The curing classifier of dielectrics based on epoxy resins

  • Author

    Mentlik, V. ; Pihera, J. ; Polansky, R. ; Prosr, P. ; Trnka, P.

  • Author_Institution
    Univ. of West Bohemia, Pilsen
  • fYear
    2006
  • fDate
    11-14 June 2006
  • Firstpage
    448
  • Lastpage
    451
  • Abstract
    Monitoring of the properties and applicability of high-voltage insulating systems containing epoxy resins require knowledge of curing degree of these resins. This curing degree is considered to be the key parameter for quality of materials used for these systems. Application of differential thermal analysis (DTA) for evaluation of curing degree of three-component composite materials (glass fabric, reconstructed mica, and epoxy resin) is presented in the article. Used analysis enables to observe characteristic structural parameter-the concentration of reaction-able particles in organic component of this material. In our investigation, concept of curing reactions courses was obtained as well as details for determination of optimal curing time of material. These conclusions have been verified with the other methods such as thermomechanical analysis (TMA) or loss factor and permittivity determination. Based upon these results it is obvious, that the conclusions correspond to one another
  • Keywords
    composite insulating materials; curing; differential thermal analysis; epoxy insulation; permittivity; polymer structure; composite material; curing classifier; dielectrics; differential thermal analysis; epoxy resin; glass fabric; high-voltage insulating system; monitoring; organic component; permittivity; reconstructed mica; thermomechanical analysis; Composite materials; Curing; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Fabrics; Glass; Monitoring; Organic materials; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2006. Conference Record of the 2006 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Print_ISBN
    1-4244-0333-2
  • Type

    conf

  • DOI
    10.1109/ELINSL.2006.1665354
  • Filename
    1665354