DocumentCode
2354166
Title
The curing classifier of dielectrics based on epoxy resins
Author
Mentlik, V. ; Pihera, J. ; Polansky, R. ; Prosr, P. ; Trnka, P.
Author_Institution
Univ. of West Bohemia, Pilsen
fYear
2006
fDate
11-14 June 2006
Firstpage
448
Lastpage
451
Abstract
Monitoring of the properties and applicability of high-voltage insulating systems containing epoxy resins require knowledge of curing degree of these resins. This curing degree is considered to be the key parameter for quality of materials used for these systems. Application of differential thermal analysis (DTA) for evaluation of curing degree of three-component composite materials (glass fabric, reconstructed mica, and epoxy resin) is presented in the article. Used analysis enables to observe characteristic structural parameter-the concentration of reaction-able particles in organic component of this material. In our investigation, concept of curing reactions courses was obtained as well as details for determination of optimal curing time of material. These conclusions have been verified with the other methods such as thermomechanical analysis (TMA) or loss factor and permittivity determination. Based upon these results it is obvious, that the conclusions correspond to one another
Keywords
composite insulating materials; curing; differential thermal analysis; epoxy insulation; permittivity; polymer structure; composite material; curing classifier; dielectrics; differential thermal analysis; epoxy resin; glass fabric; high-voltage insulating system; monitoring; organic component; permittivity; reconstructed mica; thermomechanical analysis; Composite materials; Curing; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Fabrics; Glass; Monitoring; Organic materials; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2006. Conference Record of the 2006 IEEE International Symposium on
Conference_Location
Toronto, Ont.
ISSN
1089-084X
Print_ISBN
1-4244-0333-2
Type
conf
DOI
10.1109/ELINSL.2006.1665354
Filename
1665354
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