• DocumentCode
    2354185
  • Title

    The promise of dielectric nanocomposites

  • Author

    Nelson, J. Keith

  • Author_Institution
    Rensselaer Polytech. Inst., Troy, NY
  • fYear
    2006
  • fDate
    11-14 June 2006
  • Firstpage
    452
  • Lastpage
    457
  • Abstract
    Several research groups worldwide have now been able to document some significant improvements that can be made in the electrical, and other, properties of polymer composites through the incorporation of nanoparticulates. Although it is now becoming clear that the mechanisms responsible for these changes are by no means universal, some of the benefits are substantial and rely on the large interface areas which are inherent in the introduction of materials of nanometric dimensions. By examining a variety of nanomaterials, this contribution seeks to review the property changes that can be brought about and examines the possibilities for commercial applications. This involves not only the electrical properties, but the implications for the attendant mechanical characteristics and the polymer processing necessary for utilization of this emerging breed of dielectric material. In this context, the functionalization of the participate surfaces to provide preferential coupling to the host polymer will be explored since, by this means, a degree of preferred assembly can be accommodated. Through experimental examples, the use of this technique to tailor the properties of nanodielectrics is illustrated
  • Keywords
    dielectric materials; electric strength; nanocomposites; polymers; dielectric nanocomposites; dielectric strength; electrical property; mechanical characteristics; nanometric dimension; polymer composite; polymer processing; Dielectrics and electrical insulation; Mechanical factors; Nanobioscience; Nanocomposites; Nanomaterials; Nanoparticles; Nanostructured materials; Polymers; Thermal conductivity; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2006. Conference Record of the 2006 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Print_ISBN
    1-4244-0333-2
  • Type

    conf

  • DOI
    10.1109/ELINSL.2006.1665355
  • Filename
    1665355