DocumentCode :
2354344
Title :
Electrical modeling of CBGA packages
Author :
Beker, Benjamin ; Cokkinides, George ; Agrawal, Amit P.
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
fYear :
1995
fDate :
21-24 May 1995
Firstpage :
251
Lastpage :
254
Abstract :
This paper describes a quasi-static approach for electrical modeling of package parasitics associated with ceramic ball grid arrays (CBGAs). It is based on the finite difference solution to the Laplace equation in an inhomogeneous medium. Following the computation of the charge density and capacitance, a physical non-uniform current distribution on all conductors is determined for inductance and resistance calculations. Some typical, high I/O CBGA package designs are examined to determine worst-case parasitic R, L, and C parameters
Keywords :
Laplace equations; capacitance; ceramics; current distribution; equivalent circuits; finite difference methods; inductance; integrated circuit modelling; integrated circuit packaging; Laplace equation; capacitance; ceramic ball grid arrays; charge density; electrical modeling; equivalent circuit parameters; finite difference solution; high I/O CBGA package designs; inductance calculation; inhomogeneous medium; package parasitics; physical nonuniform current distribution; quasi-static approach; resistance calculation; Ceramics; Conductors; Current distribution; Distributed computing; Electronics packaging; Finite difference methods; Inductance; Laplace equations; Parasitic capacitance; Physics computing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
Type :
conf
DOI :
10.1109/ECTC.1995.514393
Filename :
514393
Link To Document :
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