Title :
High speed polysilicon deposition process for dielectric isolation technology
Author :
Itoh, S. ; Usui, T. ; Akahane, K. ; Ishikawa, N. ; Yokoyama, T. ; Maeda, Y.
Author_Institution :
Oki Electric Industry Co., Ltd.
Keywords :
Argon; Dielectric devices; Dielectric substrates; Filling; Isolation technology; Large scale integration; Resistance heating; Silicon; Spraying; Voltage;
Conference_Titel :
Power Semiconductor Devices and ICs, 1990. ISPSD '90. Proceedings of the 2nd International Symposium on
DOI :
10.1109/ISPSD.1990.991080
