Title :
Low-power, parallel photonic interconnections for multi-chip module applications
Author :
Carson, R.F. ; Lovejoy, M.L. ; Lear, K.L. ; Warren, M.E. ; Blum, O. ; Kilcoyne, S.P. ; Du, T. ; Seigal, P.K. ; Craft, D.C. ; Rose, B.H.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated micro-optics, and MCM-compatible packaging techniques
Keywords :
multichip modules; optical interconnections; 100 Mbit/s; HBT photoreceivers; VCSELs; cost; drive circuitry; integrated micro-optics; low-power photonic interconnections; multi-chip module; packaging; parallel link array; reliability; signal processor stack; vertical interconnection; Clocks; Electronics packaging; High speed optical techniques; Integrated circuit interconnections; Optical crosstalk; Optical interconnections; Optical signal processing; Photonics; Signal processing; Stacking;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514411
