• DocumentCode
    2354695
  • Title

    Distributed on-chip power grid modeling: an electromagnetic alternative to RLC extraction-based models

  • Author

    Ihm, Jae-Yong ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    37
  • Lastpage
    40
  • Abstract
    A methodology is presented for on-chip power grid modeling with uncompromised electromagnetic accuracy. The proposed methodology avoids the painstaking and error-prone process of power grid inductance extraction. Furthermore, the model is developed directly from the differential form of Maxwell´s equations, and thus avoids the dense-matrix issues that arise when PEEC-based electromagnetic models are utilized. Finally, it has the unique attribute that, in addition to providing for on-chip power switching modeling with electromagnetic accuracy it enables the direct modeling of distributed power-grid induced electromagnetic interference.
  • Keywords
    Maxwell equations; circuit simulation; computational electromagnetics; electromagnetic interference; electronic design automation; integrated circuit modelling; power supply circuits; computational flexibility; differential Maxwell´s equations; distributed modeling; electromagnetic accuracy; electromagnetic interference; on-chip power grid modeling; on-chip power switching modeling; package parasitics; power supply network; Electromagnetic fields; Electromagnetic modeling; Inductance; Integral equations; Integrated circuit interconnections; Maxwell equations; Packaging; Power grids; Power supplies; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1249995
  • Filename
    1249995