Title :
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
Author :
Schuster, Christian ; Kuchta, Daniel M. ; Colgan, Evan G. ; Cohen, Guy M. ; Trewhella, Jeannine M.
Abstract :
In this paper the electrical package design for a 10 Gbps laser diode on a silicon optical bench will be presented. Specifically the wideband impedance matching is addressed. Simulated data will be compared to measurements.
Keywords :
impedance matching; integrated optoelectronics; optical transmitters; semiconductor device packaging; semiconductor lasers; 10 Gbit/s; electrical package design; eye diagrams; laser diode; low cost; packaging platform; parasitic elements; precision etched alignment features; silicon optical bench; small area consumption; wideband impedance matching; Dielectric substrates; Diode lasers; Electronics packaging; High speed optical techniques; Optical attenuators; Optical design; Optical films; Silicon; Surface emitting lasers; Wideband;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250001
