DocumentCode
2354801
Title
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
Author
Schuster, Christian ; Kuchta, Daniel M. ; Colgan, Evan G. ; Cohen, Guy M. ; Trewhella, Jeannine M.
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
63
Lastpage
66
Abstract
In this paper the electrical package design for a 10 Gbps laser diode on a silicon optical bench will be presented. Specifically the wideband impedance matching is addressed. Simulated data will be compared to measurements.
Keywords
impedance matching; integrated optoelectronics; optical transmitters; semiconductor device packaging; semiconductor lasers; 10 Gbit/s; electrical package design; eye diagrams; laser diode; low cost; packaging platform; parasitic elements; precision etched alignment features; silicon optical bench; small area consumption; wideband impedance matching; Dielectric substrates; Diode lasers; Electronics packaging; High speed optical techniques; Optical attenuators; Optical design; Optical films; Silicon; Surface emitting lasers; Wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250001
Filename
1250001
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