Title :
Impact and modeling of anti-pad array on power delivery system
Author :
Yang, Zhiping ; Zhao, Jin ; Camerlo, Sergio ; Fang, Jiayuan
Author_Institution :
Cisco Syst., Inc., San Jose, CA, USA
Abstract :
The impact of anti-pad array on power and ground planes,. especially at the area right under the BGA package, has been studied in this paper. An effective modeling and simulation approach based on 3D field computation has been used to take into account the anti-pad array effect. The simulation results match the measurement results. It has been found that the effect of anti-pad array on power delivery system is considerable; therefore it cannot be ignored in the power delivery system analysis and design for high-speed applications.
Keywords :
S-parameters; SPICE; ball grid arrays; chip-on-board packaging; circuit simulation; equivalent circuits; multichip modules; 3D field computation; ASIC package; BGA package; SPICE; anti-pad array; equivalent parameters; ground planes; high-speed applications; modeling approach; power delivery system; signal integrity software; simulation approach; two-port S-parameter; Capacitance; Computational modeling; Frequency; Hardware; Inductance; Integrated circuit modeling; Internet; Packaging; Power system modeling; Power transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250012
