Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Author

Kim, Hyungsoo ; Jeong, Youchul ; Park, Jongbae ; Lee, SeokKy ; JongKuk-Hong ; Hong, Youngsoo ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea

fYear

2003

fDate

27-29 Oct. 2003

Firstpage

129

Lastpage

132

Abstract

Significant reduction of power/ground inductive impedance and SSN suppression was successfully demonstrated by using embedded capacitor film in high performance package and PCB up to 3GHz frequency range. The reduction of the inductance impedance and SSN are acquired by the help of reduced via inductance in the embedded film capacitor.

Keywords

chip-on-board packaging; electric impedance; frequency-domain analysis; inductance; integrated circuit noise; power supply circuits; printed circuits; thin film capacitors; time-domain analysis; PCB; discrete decoupling capacitor; embedded capacitor film; frequency domain measurement; high performance package; power-ground inductive impedance; reduced via inductance; simultaneous switching noise; time domain measurement; Capacitors; Clocks; Frequency; Impedance measurement; Inductance; Noise measurement; Noise reduction; Packaging; Power measurement; Size measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2003

Conference_Location

Princeton, NJ, USA

Print_ISBN

0-7803-8128-9

Type

conf

DOI

10.1109/EPEP.2003.1250015

Filename

1250015