DocumentCode
235507
Title
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
Author
Taira, Yoichi ; Mizusawa, Ryuma ; Matsumoto, R. ; Sueoka, Kazuhisa ; Numata, Hidetoshi
Author_Institution
IBM Res. - Tokyo, Kawasaki, Japan
fYear
2014
fDate
27-30 May 2014
Firstpage
1870
Lastpage
1875
Abstract
Optical out coupling is one of the key research items of silicon photonic packaging. It is necessary to realize robust, high-bandwidth, low-power optical data communication system in an economical way. Because material interfaces are always involved for the coupling, the reflection loss at the interface often occupies a major part of loss. Here we report on an ideal anti-reflection coating method for use with silicon nanophotonics devices. Because the refractive index of silicon is large at about 3.5, the optical reflection at the silicon waveguide boundary is large. We describe a set of nanoparticle-based spin-on materials having indices of 1.8 and 1.2. The former material is suitable for a single layer anti-reflection coating on a silicon surface and realizes a first order thin reflection suppression which allows large bandwidth and large angle tolerance. The latter material is for coating of the fiber or polymer interface. We studied the feasibility of uniform coating over microlens structures. High index material is also photo patternable, which is desirable for silicon chip integration.
Keywords
antireflection coatings; low-power electronics; nanophotonics; optical communication equipment; optical waveguides; refractive index; antireflection coating method; fiber interface; nanofiller; nanoparticle-based spin-on materials; negligible reflection; optical data communication system; optical reflection; polymer interface; reflection loss; refractive index; silicon chip integration; silicon nanophotonics devices; silicon photonic packaging; silicon waveguide boundary; thin reflection suppression; Optical fibers; Optical reflection; Optical refraction; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897555
Filename
6897555
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