• DocumentCode
    2355161
  • Title

    Mixed signal validation of the Intel/spl reg/ Pentium/spl reg/ 4 microprocessor power-up sequence

  • Author

    Pan, Y.C. ; Mughal, U.A. ; Rifani, M.C. ; Wilson, T.M.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    The design of a robust microprocessor requires extensive logic validation. Millions of test vectors are applied and the output of every logic node is checked against the expected output. This is largely done with RTL simulators. Such simulators ignore the analog aspects of the circuits such as power supply noise and transmission line effects. Traditionally, the analog aspects are taken into account using SPICE-like simulators to model representative cases and design for what is perceived to be the worst-case input stimulus. Alternatively, in this paper, we will present a mixed signal validation approach that comprehends both the logic and analog aspects of the circuits. We show how we applied this to the Pentium 4 processor power-up sequence validation. We will also discuss extending this approach to other disciplines such as platform and packaging.
  • Keywords
    SPICE; circuit CAD; circuit simulation; computer power supplies; digital phase locked loops; integrated circuit modelling; logic CAD; logic simulation; microprocessor chips; power supply circuits; Intel Pentium 4 microprocessor; PLL circuits; SPICE-like netlists; behavioral description models; design specifications; digital behavioral models; logic validation; mixed signal validation; mixed-signal CAD; on-chip power-on circuitry; power-up sequence; robust microprocessor design; transistor level netlists; Circuit noise; Circuit simulation; Circuit testing; Distributed parameter circuits; Logic design; Logic testing; Microprocessors; Noise robustness; Power supplies; Power transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250023
  • Filename
    1250023