Title :
Package model synthesis
Author_Institution :
Texas Instruments, Austin, TX, USA
Abstract :
To address the need for package models in the earliest project stages before package layout has even begun, a package description language and a package model synthesizer have been developed and are described.
Keywords :
ball grid arrays; electronic design automation; electronics packaging; flip-chip devices; visual databases; C code; design databases; dynamic memory allocation; flip-chip PBGA; general-purpose electromagnetic algorithms; model netlist; package description language; package layout; package model synthesizer; physical model; signal integrity; Bandwidth; Data mining; Databases; Electromagnetic forces; Electromagnetic modeling; Integrated circuit interconnections; Packaging; Page description languages; Signal design; Synthesizers;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250025
