Title :
Micro-channel heat exchanger optimization
Author :
Harpole, George M. ; Eninger, James E.
Author_Institution :
TRW, Redondo Beach, CA, USA
Abstract :
A complete two-dimensional flow/thermal model of the micro-channel cooler is developed. Optimization of the design parameters with this model is demonstrated for the case of a 1 kW/cm2 heat flux with the top surface at 25°C. For this case, pure water could be used as the coolant, or 92% water/8% methanol (-5°C freezing point) if the heat is to be dumped to ice/water. The flow rate should be about 50 cc/s per cm2 of surface area. The distribution manifold channel spacing (center-to-center) should be 333 μm (30 channels/cm). The fin height should be about 167 μm (HF/L =1). The distribution manifold channel widths should be about 200 μm (W/L=0.6). The micro-channels should be between 7 μm and 14 μm wide, while the ratio of fin thickness to micro-channel width should be from 0.5 to 1.0. With these design parameters, an effective heat transfer coefficient (surface heat flux divided by surface to coolant inlet temperature difference) on the order of 100 W/cm2 K will be achieved with a total pressure drop of only about 2 bar
Keywords :
cooling; heat exchangers; micromechanical devices; optimisation; semiconductor technology; 2D flow model; 2D thermal model; Si etching; distribution manifold channel spacing; distribution manifold channel widths; fin height; fin thickness; flow rate; heat transfer coefficient; micro-channel cooler; micro-channel heat exchanger; optimization; surface heat flux; surface to coolant inlet temperature difference; total pressure drop; water coolant; water methanol; Coolants; Cooling; Design optimization; Etching; Heat transfer; Semiconductor laser arrays; Silicon; Stacking; Surface emitting lasers; Temperature;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-87942-664-0
DOI :
10.1109/STHERM.1991.152913