Title :
Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model
Author :
Pak, Jun So ; Lee, Junwoo ; Kim, Hyungsoo ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.
Keywords :
circuit resonance; coupled circuits; printed circuit design; transmission line matrix methods; balanced TLM model; power/ground plane edge radiation; power/ground plane resonance; through-hole signal via excited radiation; via broken return current path; via coupling model; Analytical models; Computational modeling; Computer science; Digital systems; Frequency; Impedance; Packaging; Predictive models; Resonance; Signal analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250027
