Title :
Design and analysis of multi-gigahertz parallel bus interfaces of low-cost and band-limited channels
Author :
Beyene, Wendemagegnehu T. ; Cheng, Newton ; Yuan, Chuck
Author_Institution :
Rambus Inc, Los Altos, CA, USA
Abstract :
The further scaling of chip performance into multi-gigabit data rates puts special demands on the bandwidth of interconnect systems. This leads to the need for careful optimization of the parameters of the channel and the components along the path of the signal and the need of special circuitry in transceivers to mitigate the effects of the band-limited channels. This paper characterizes various bandwidth limiting factors in a low-cost interconnect system and evaluates equalization techniques that are needed to overcome the limitations to improve the interconnect system performance at multi-gigabit data rates. The sensitivity of equalization taps to manufacturing variations in channel parameters is also studied. Finally, detailed analyses of low-cost and high-speed memory operating at 3.2 Gbps and logic-to-logic interconnect systems operating at 6.4 Gbps are presented to illustrate the effectiveness of equalization techniques.
Keywords :
ball grid arrays; decision feedback equalisers; flip-chip devices; interconnections; intersymbol interference; printed circuits; system buses; timing jitter; transceivers; band-limited interconnect system; bandwidth limiting factors; channel parameters; decision feedback equalizers; equalization techniques; eye heights; flip-chip BGA; intersymbol interference; linear equalizers; logic-to-logic interconnect; low-cost high-speed memory; low-cost interconnect system; manufacturing variations; multi-gigabit data rates; multi-gigahertz parallel bus interfaces; timing jitters; transfer function; wirebond packages; Attenuation; Bandwidth; Conducting materials; Dielectric losses; Energy loss; Frequency; Integrated circuit interconnections; Packaging; Propagation losses; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250034