• DocumentCode
    2355342
  • Title

    Design and analysis of multi-gigahertz parallel bus interfaces of low-cost and band-limited channels

  • Author

    Beyene, Wendemagegnehu T. ; Cheng, Newton ; Yuan, Chuck

  • Author_Institution
    Rambus Inc, Los Altos, CA, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    213
  • Lastpage
    216
  • Abstract
    The further scaling of chip performance into multi-gigabit data rates puts special demands on the bandwidth of interconnect systems. This leads to the need for careful optimization of the parameters of the channel and the components along the path of the signal and the need of special circuitry in transceivers to mitigate the effects of the band-limited channels. This paper characterizes various bandwidth limiting factors in a low-cost interconnect system and evaluates equalization techniques that are needed to overcome the limitations to improve the interconnect system performance at multi-gigabit data rates. The sensitivity of equalization taps to manufacturing variations in channel parameters is also studied. Finally, detailed analyses of low-cost and high-speed memory operating at 3.2 Gbps and logic-to-logic interconnect systems operating at 6.4 Gbps are presented to illustrate the effectiveness of equalization techniques.
  • Keywords
    ball grid arrays; decision feedback equalisers; flip-chip devices; interconnections; intersymbol interference; printed circuits; system buses; timing jitter; transceivers; band-limited interconnect system; bandwidth limiting factors; channel parameters; decision feedback equalizers; equalization techniques; eye heights; flip-chip BGA; intersymbol interference; linear equalizers; logic-to-logic interconnect; low-cost high-speed memory; low-cost interconnect system; manufacturing variations; multi-gigabit data rates; multi-gigahertz parallel bus interfaces; timing jitters; transfer function; wirebond packages; Attenuation; Bandwidth; Conducting materials; Dielectric losses; Energy loss; Frequency; Integrated circuit interconnections; Packaging; Propagation losses; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250034
  • Filename
    1250034