Title :
Pool boiling enhancement techniques for water at low pressure
Author :
McGillis, Wade R. ; Carey, Van P. ; Fitch, John S. ; Hamburgen, William R.
Author_Institution :
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
Abstract :
Saturated pool boiling of water at low pressures from a heated, 12.7×12.7 mm horizontal surface was examined. Rectangular fins, fluidized particulate beds, and surface finishes were used to enhance heat transfer. Water at low pressure significantly decreases the boiling performance below that of water at atmospheric pressure. However, surface temperatures are reduced to values acceptable for cooling electronic components. All rectangular fin geometries were found to enhance heat transfer, although certain geometries were more effective. The finned surfaces extended the base area critical heat flux beyond the critical heat flux for the flat plate. Rougher surface finishes reduced wall superheat temperatures. The addition of non-wetting, TFE particles also decreased wall superheat temperatures for the isolated bubble regime
Keywords :
boiling; cooling; water; TFE particles; base area critical heat flux; electronic component cooling; fluidized particulate beds; heat transfer; isolated bubble regime; low pressure; pool boiling enhancement; rectangular fins; saturated pool boiling; surface finishes; surface temperatures; wall superheat temperatures; water; Electronic components; Electronics cooling; Fluidization; Geometry; Heat transfer; Rough surfaces; Surface finishing; Surface roughness; Temperature; Water heating;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-87942-664-0
DOI :
10.1109/STHERM.1991.152914