Title :
Applications of closed-form wiring escape formulae to a high performance printed wiring board
Author :
Zhou, Tingdong ; Katopis, George A.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
Closed-form formulae are derived for wiring escape from an area array to the standard horizontal ground rules of the package level under consideration. The required layer counts for successful escape based on two strategies are given in this paper. The effects of lines per channel, extra channels at the edges of an area array, different via technologies, and signal pin depopulation are considered in the derivations. The resulting closed-form formulae are also used to a high performance printed wiring board for the estimation of the layers needed. The estimation of the layer count from our formulae agrees with the one achieved empirically in the actual design.
Keywords :
electronics packaging; multichip modules; printed circuit layout; MCM; area array; area array packaging; closed-form wiring escape formulae; extra channels; high performance printed wiring board; lines per channel; signal pin depopulation; standard horizontal ground rules; via technologies; Bandwidth; Cost function; Integrated circuit interconnections; Manufacturing; Packaging; Pins; Routing; Wire; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250037