DocumentCode
2355409
Title
P2J-1 Love-Wave Characterization Platform for Micro and Nano Processed Thin Films
Author
Zimmermann, C. ; Rebiere, D. ; Dejous, C. ; Pistre, J.
Author_Institution
Lab. IXL, Univ. Bordeaux, Talence
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
1809
Lastpage
1812
Abstract
Acoustic wave sensors uses more and more often micro and nano-structured thin film new materials (e.g. as sensitive layer). This lead to an increasing need for materials viscoelastic properties characterization. A new characterization method is proposed here using Love-wave platforms and allowing the material properties characterization directly with the sensor platform. A Love-wave device consists in a multilayer structure with a piezoelectric substrate, a guiding layer and, for chemical detections, a sensitive layer able to trap chemical species. Sensitive and guiding layers involve thin films organic and inorganic materials in which a 100 MHz Love-wave propagates during sensor operation. Materials are then excited at high frequency and mechanical properties are affected by the wave propagation. The characterization method determines material layer density and shear modulus by fitting simulation results to experimental measurements. First results concern the characterization of Love-wave SiO2 guiding layer and demonstrate that using characterized SiO2 density and shear modulus allows to simulate accurately the wave phase velocity of Love-wave devices with different SiO2 guiding layer thicknesses
Keywords
Love waves; acoustic measurement; materials testing; multilayers; shear modulus; silicon compounds; thin films; viscoelasticity; 100 MHz; Love wave characterization; Love wave device; SiO2; SiO2 guiding layer; acoustic wave sensors; chemical detections; material layer density; microstructured thin film; multilayer structure; nanostructured thin film; piezoelectric substrate; shear modulus; viscoelastic properties characterization; wave phase velocity; wave propagation; Acoustic materials; Acoustic sensors; Acoustic waves; Chemical sensors; Elasticity; Piezoelectric films; Sensor phenomena and characterization; Thin film sensors; Transistors; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.455
Filename
4152311
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