Title :
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
Author :
Minhua Lu ; Goldsmith, Charles ; Wassick, Thomas ; Perfecto, Eric ; Arvin, Charles
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The effect of Ag and Cu concentrations on the electromigration of Pb-free solder was investigated. A nine cell experiment with Ag concentrations ranging from 1.2% to 2.2% and Cu concentrations ranging from 0.2 to 2.7% was conducted. Although the EM performance was found to be insensitive to the Ag and Cu concentrations in the range of the study, solder with 1.7% Cu showed the least Ag content dependence. EM failures occurred primarily on the substrate side. An effect of Sn grain texture with Ag and Cu concentrations was also observed.
Keywords :
copper alloys; electromigration; silver alloys; solders; tin alloys; Ag; Cu; Sn; electromigration; grain texture; solder; substrate side; Electromigration; Nickel; Reliability; Scanning electron microscopy; Substrates; Tin;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897567
