DocumentCode
235544
Title
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
Author
Minhua Lu ; Goldsmith, Charles ; Wassick, Thomas ; Perfecto, Eric ; Arvin, Charles
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1940
Lastpage
1943
Abstract
The effect of Ag and Cu concentrations on the electromigration of Pb-free solder was investigated. A nine cell experiment with Ag concentrations ranging from 1.2% to 2.2% and Cu concentrations ranging from 0.2 to 2.7% was conducted. Although the EM performance was found to be insensitive to the Ag and Cu concentrations in the range of the study, solder with 1.7% Cu showed the least Ag content dependence. EM failures occurred primarily on the substrate side. An effect of Sn grain texture with Ag and Cu concentrations was also observed.
Keywords
copper alloys; electromigration; silver alloys; solders; tin alloys; Ag; Cu; Sn; electromigration; grain texture; solder; substrate side; Electromigration; Nickel; Reliability; Scanning electron microscopy; Substrates; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897567
Filename
6897567
Link To Document