DocumentCode :
235551
Title :
Chemical mechanical polishing mechanisms for gallium nitride: Quantum chemical molecular dynamics simulations
Author :
Kawaguchi, Kentaro ; Aizawa, Takehiro ; Higuchi, Yuji ; Ozawa, Nobuki ; Kubo, Momoji
Author_Institution :
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear :
2014
fDate :
19-21 Nov. 2014
Firstpage :
39
Lastpage :
41
Abstract :
We developed a chemical mechanical polishing (CMP) simulator based on tight-binding quantum chemical molecular dynamics method and applied it to gallium nitride (GaN) CMP process. We successfully clarified the chemical reaction dynamics at the friction interface between the GaN substrate and an abrasive grain in pure water; surface-adsorbed H2O molecules, OH groups, and H atoms are generated by the adsorption and dissociation of water on the GaN surface. Our developed CMP simulator is capable of predicting the CMP processes controlled by chemical reactions.
Keywords :
III-V semiconductors; abrasion; adsorption; chemical mechanical polishing; dissociation; friction; gallium compounds; molecular dynamics method; tight-binding calculations; water; wide band gap semiconductors; GaN; H2O; abrasive grain; adsorption; chemical mechanical polishing; chemical reactions; dissociation; friction interface; gallium nitride; surface-adsorbed molecules; tight-binding quantum chemical molecular dynamics method; Abrasives; Chemicals; Gallium nitride; Planarization; Substrates; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
Type :
conf
DOI :
10.1109/ICPT.2014.7017241
Filename :
7017241
Link To Document :
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