DocumentCode :
235559
Title :
Innovative advanced nanotechnology test mask for chemical and mechanical planarization process prediction
Author :
Tolic, Frank ; Burroughs, Tricia ; Borst, Christopher ; Hill, Richard ; Penigelapati, Dinesh ; Nalaskowski, Jakub ; PapaRao, Satyavolu
Author_Institution :
Colleges of Nanoscale Sci. & Eng., SUNY Polytech. Inst., Albany, NY, USA
fYear :
2014
fDate :
19-21 Nov. 2014
Firstpage :
54
Lastpage :
58
Abstract :
There is an urgent need to provide a new Chemical Mechanical Planarization (CMP) test mask standard to the CMP development community. Updated test mask geometries are required to maintain relevance for 14 nm and beyond R&D. One of the key historical challenges to successfully generating a test mask offering was ensuring critical feedback from across the development user community. This feedback is essential to build a well-accepted test standard that captures critical CMP effects and allows process benchmarking and comparison. This was previously achieved by deep collaboration between industry consortia, academia, and a state-of-the-art research and development facility. The SUNY Polytechnic Institute´s College of Nanoscale Science and Engineering (CNSE) and SEMATECH have joined together to develop a next generation CMP test vehicle, and are using the proven collaboration model to design an industry validated, technologically relevant mask set and test structure offering. The mask will include legacy structures similar to the original SEMATECH/MIT mask standard, but will focus on providing advanced structures and designs necessary to address today´s CMP challenges.
Keywords :
chemical mechanical polishing; masks; planarisation; CMP development community; CMP effects; SEMATECH-MIT mask standard; chemical mechanical planarization process prediction; chemical mechanical planarization test mask standard; development user community; innovative advanced nanotechnology test mask; next generation CMP test vehicle; size 14 nm; test structure; updated test mask geometry; Collaboration; Communities; Industries; Layout; Next generation networking; Planarization; Standards;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
Type :
conf
DOI :
10.1109/ICPT.2014.7017244
Filename :
7017244
Link To Document :
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