DocumentCode
235559
Title
Innovative advanced nanotechnology test mask for chemical and mechanical planarization process prediction
Author
Tolic, Frank ; Burroughs, Tricia ; Borst, Christopher ; Hill, Richard ; Penigelapati, Dinesh ; Nalaskowski, Jakub ; PapaRao, Satyavolu
Author_Institution
Colleges of Nanoscale Sci. & Eng., SUNY Polytech. Inst., Albany, NY, USA
fYear
2014
fDate
19-21 Nov. 2014
Firstpage
54
Lastpage
58
Abstract
There is an urgent need to provide a new Chemical Mechanical Planarization (CMP) test mask standard to the CMP development community. Updated test mask geometries are required to maintain relevance for 14 nm and beyond R&D. One of the key historical challenges to successfully generating a test mask offering was ensuring critical feedback from across the development user community. This feedback is essential to build a well-accepted test standard that captures critical CMP effects and allows process benchmarking and comparison. This was previously achieved by deep collaboration between industry consortia, academia, and a state-of-the-art research and development facility. The SUNY Polytechnic Institute´s College of Nanoscale Science and Engineering (CNSE) and SEMATECH have joined together to develop a next generation CMP test vehicle, and are using the proven collaboration model to design an industry validated, technologically relevant mask set and test structure offering. The mask will include legacy structures similar to the original SEMATECH/MIT mask standard, but will focus on providing advanced structures and designs necessary to address today´s CMP challenges.
Keywords
chemical mechanical polishing; masks; planarisation; CMP development community; CMP effects; SEMATECH-MIT mask standard; chemical mechanical planarization process prediction; chemical mechanical planarization test mask standard; development user community; innovative advanced nanotechnology test mask; next generation CMP test vehicle; size 14 nm; test structure; updated test mask geometry; Collaboration; Communities; Industries; Layout; Next generation networking; Planarization; Standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location
Kobe
Print_ISBN
978-1-4799-5556-5
Type
conf
DOI
10.1109/ICPT.2014.7017244
Filename
7017244
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