Construction and validation of thermal models of packages

A numerical method used for the thermal modeling of electronic packages is explained and compared with experimental results. This numerical approach is based on the Visula EDA Thermal Analysis tool. The methodology adopted allows one to build thermal models which can be considered valid in any environmental condition. The experimental investigation shows the limits within which this assertion is true. However, in most common cases encountered in electronic cooling, the comparison between simulated and measured junction temperatures showed a satisfactory agreement