DocumentCode :
2355779
Title :
The necessity and consequences of modeling driver and load nonlinearity in on-chip global interconnect noise verification
Author :
Feldmann, Peter
Author_Institution :
IBM Thomas J. Watson Res. Center, NY, USA
fYear :
2003
fDate :
27-29 Oct. 2003
Firstpage :
321
Lastpage :
324
Abstract :
The verification of noise in on-chip global interconnect is performed through simulation of an electrical circuit comprised of a network of coupled transmission lines, terminated by appropriate models for drivers (transmitters) and loads (receivers). The current methodology utilizes linearized models of the terminations, thus requiring only linear circuit simulations. In this study, we show that while a linear noise analysis methodology that relies on the termination model linearization is very efficient and convenient, it may result in significant loss of accuracy and/or in excessively conservative designs. We identify the situations where modeling the nonlinearity of the termination becomes a determining factor in the accuracy of the analysis. We also study the implications of adopting a fully nonlinear analysis methodology, and propose a practical compromise.
Keywords :
circuit layout CAD; circuit simulation; digital integrated circuits; driver circuits; integrated circuit interconnections; integrated circuit noise; lumped parameter networks; transmission line theory; coupled transmission lines; digital circuits; driver nonlinearity; equivalent lumped element network; fully nonlinear analysis methodology; load nonlinearity; multiconductor transmission line; noise verification; on-chip global interconnect; termination nonlinearity; Circuit noise; Circuit simulation; Coupling circuits; Distributed parameter circuits; Driver circuits; Integrated circuit interconnections; Linear circuits; Load modeling; Network-on-a-chip; Transmitters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
Type :
conf
DOI :
10.1109/EPEP.2003.1250059
Filename :
1250059
Link To Document :
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